Komèsyal cho HDI Multilayer FR4 PCB Circuit Boards pou Micro SD Kat
Detay rapid:
Epesè Copper: 1 oz
Epesè tablo: 1.0mm
Min.Gwosè twou: 0.20mm
Min.Lajè liy: 0.075mm
Min.Liy Espas: 0.075mm
Fini sifas: ENIG
Gwosè Komisyon Konsèy: Customized
Koulè mask soude: lank vèt
Tolerans epesè tablo: +/-10%
V-koupe ang: 25 °, 30 °, 45 °, 60 °
Tòde & vlope: ≤ 0.5%
File:Pro tel 99se/P-CAD/Auto cad/Cam350
Anbalaj enteryè: anbalaj vakyòm, sak plastik
Anbalaj ekstèn: anbalaj katon estanda
Sèvis: PCB & PCBA
Kouch: 6 kouch
Mask swa: Blan
Deskripsyon pwodwi
| 1 | Deskripsyon | Spesifikasyon PCB |
| 2 | Materyèl | FR-4/HTG150-180 FR-4/CEM-1/CEM-3/Aliminyòm |
| 3 | Kouch | 1-20 |
| 4 | Epesè Komisyon Konsèy | 0.2mm- 4.0mm |
| 5 | Tolerans epesè tablo | +/-10% |
| 6 | Epesè kwiv | 17.5um-175um (0.5oz-5oz) |
| 7 | Min lajè tras | 0.15mm |
| 8 | Min lajè espas | 0.15mm |
| 9 | Min Perçage Dia | 0.2mm |
| 10 | PTH epesè kwiv | 0.4-2mil (10-50um) |
| 11 | Tolerans nan grave | ± 1mil (± 25um) |
| 12 | V-koupe ang | 25°,30°,45°,60° |
| 13 | Pearl fòs nan liy | ≥ 6lb/pous (≥ 107g/mm) |
| 14 | Kontwòl enpedans ak tolerans | 50Ω±10% |
| 15 | Tòde & Vlope | ≤ 0.5% |
| 16 | Mask soude | Vèt, wouj, ble, blan, nwa, jòn |
| 17 | Sifas fini/Plating | HASL/San Plon HASL/OSP/Gold Plating/Immersion Gold/ENIG |
| 18 | Sètifika | ROSH.ISO9001 |
| 19 | File | Protel 99se/P-CAD/Auto cad/Cam350 |
| 20 | Anbalaj enteryè | Anbalaj vakyòm, sak plastik |
| 21 | Eksteryè anbalaj | Anbalaj katon estanda |
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