Kapasite FR4:
Atik | Espesifikasyon teknik |
---|---|
Kalite Materyèl | FR-1, FR-4, CEM-1, CEM-3, Rogers, ISOLA |
Epesè materyèl | 0.062", 0.080", 0.093", 0.125", 0.220", 0.047", 0.031", 0.020", 0.005" |
Konte kouch | 1 a 20 Kouch |
Max.Gwosè Komisyon Konsèy | 22.00" x 28.00" |
Klas IPC | Klas II, Klas III |
Anile bag | 5 mil/bò oswa pi gwo (Min. Design) |
Fini Plating | Soude (HASL), Soude san plon (L/F HASL), ENIG (Electroless Nikèl Immersion Gold), OSP, Immersion Silver, Immersion Tin, Immersion Nikèl, Hard Gold, elatriye. |
Pwa Copper | Eksteryè: Jiska 7oz, Entèn: jiska 4 oz. |
Lajè tras/espas | 3/3 mil |
Pi piti gwosè pad | 12 mil |
Plake Fant | 0.016" |
Pi piti twou | 8mil;4 mil |
Dwèt lò | 1 a 4 Edge (30 a 50 Micron lò) |
SMD anplasman | 0.080" - 0.020" - 0.010" |
Kalite Soldermask | LPI Briyan, LPI-Ma |
Soldermask Koulè | Vèt, wouj, ble, nwa, blan, jòn, klè |
Lejand koulè | Blan, jòn, nwa, wouj, ble. |
Lajè wout minimòm | 0.031" |
Nòt (v-cut) | Liy Dwat, Nòt So, CNC V-CUT. |
Lò | DIFÒSÈ, MOUN, IMERSION (jiska 50 MICRON GOLD) |
Fòma Fichye Done | Gerber RS-274x ak Ouverture embedder. |
Fab.Fòma Desen | Gerber Files, DXF, DWG, PDF |
Aspè rapò | 10:01 |
Counter Lavabo / Counter Bore | Wi |
Enpedans kontwòl | Wi |
Avèg Vias / Buried Vias | Wi |
Peelable Mask | Wi |
Kabòn | Wi |
Kapasite MC PCB:
Atik | Espesifikasyon teknik |
---|---|
Kantite kouch | Single bò, doub kote, kat kouch MCPCB |
Kalite pwodwi | Aliminyòm, kwiv, fè baz MCPCB |
Founisè Plastifye | Berquist, Ventec, Polytronics, Boyu, Wazam elatriye. |
Fini epesè tablo | 0.2 ~ 5.0mm |
Epesè kwiv | Hoz-3oz |
Founisè mask soude | Taiyo, Fotochem elatriye. |
Koulè mask soude | Blan, nwa, wouj, ble, jòn elatriye. |
Sifas fini | L/F HASL, OSP, ENIG, Elèktrolitik Silver, Immersion Tin, Immersion Silver elatriye. |
Kalite deskripsyon fini | Routage, pwensonaj, V-koupe |
Bow ak tòde | ≤0.75% |
Min gwosè twou a | 1.0mm |
Max.gwosè tablo | 1500mmX610mm |
Min.gwosè tablo | 10mmX10mm |